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| I. Introduction of the unparalleled 3D¡ºMoldFlow¡»Simulation |
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To optimize the design of L/F & Package |
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By simulating the pattern of resin filling inside package |
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At initial stage of developing a new package |
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Molding quality problems such as Voids,
Incomplete Fill, |
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Wire Sweep, etc, can be detected & resolved in pre- |
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emptive manner without having to engage in the cycle of |
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trial and error. |
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| II. Simulation Procedure (Lead-time : 2 weeks) |
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Data Collection : Application of Package & L/F |
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Analysis on existing mold design |
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Drawing amendment as per 3D simulation |
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New parts fabrication for test and evaluation |
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Actual test(Book Mold test) |
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Comparison of evaluation data with 3D simulation |
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Optimization on Variable data |
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Final Optimization |
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